Mechanical Design Reliability Monograph
by James McLinn
This first edition of this monograph created a lot of interest in mechanical reliability topics. While the world is primarily electronic, all of the packages, circuit boards, enclosures, housing are mechanical. These primarily serve to protect and support the electronics within. As semiconductor die shrink and simultaneously increase in power, operate at Gigahertz frequencies the packaging becomes a bigger and bigger issue. Heat conduction, cooling, high frequency termination, compatibility with lead free solder, and ability to remain firmly attached to circuit boards is an increasing challenge. Since the original monograph in 1998, MEMS technology and a host of small scale devices have made an understanding of mechanical reliability more important. Every quality engineer, manufacturing engineer, reliability engineer and project manager should be familiar with more of these topics, if only at a basic level. Material properties, magneto-striction, thin films, seals, corrosion, wear out, implantable devices and sensors combined with quantum effects will dominate the next 10 years of reliability.
This monograph will remain short, simple and to the point for all of its examples. This makes it easy to follow for quality and reliability engineers. No prior extensive mechanical or reliability knowledge is assumed. The use of statistics remains at a minimum and the background formulas shown where it would be useful to the reader. A wide variety of simple and useful examples are shown in the text. The author has presented a much longer reference list and a number of web sources for those topics that might be of interest to the practical reliability engineer. Excessive use of statistical tools has been avoided because most engineers find the language of statistics to be foreign and often obscures the engineering. There are plenty of statistics books on the market, if that is the desire of the reader.
Download link: Mechanical Design Reliability Monograph