Manufacturability & Reliability Challenges with QFN

Cheryl Tulkoff

Cheryl Tulkoff, CRE, DfR Solutions Senior Member of the Technical StaffCheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional a...read more



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The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.

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