Broad Impact of Electrostatic discharge (ESD) on Product Quality and Reliability (Part 2 of 2)

Ted Dangelmayer



Details

In this seminar, we discuss the challenges designers will be facing over the next several years. Changes in technology will continue to put pressure on designers to provide adequate protection but often without good information or tools. Highlights of the following will be covered: The shrinking design window for CMOS integrated circuits; changes in component level ESD threshold targets and the lack of availability of component information; the implications of new packaging and interconnect technologies such as through silicon vias (TSV); design of system connection and user interfaces; the use and misuse of component level ESD information for system level protection and emerging methods for co-design; and the evolution of EOS/ESD testing methods and standards.

- Login to view the videos -



Slideshow



Interested in Membership?

Take charge of your career and education. Join us today and get access to a wealth of webinars covering cutting edge topics important in reliability engineering today!

Find out more
Webinar Categories
Previous Webinars
  • How to graph, analyze and compare sets of repair data
    June 9, 2011
    View Webinar
  • A Novel View of Applying FMECA to Software Engineering
    October 10, 2013
    View Webinar
Networking

Provide a global forum for networking among practitioners of reliability engineering, management and related topics,

Growth

Facilitate growth and development of division members,

Provide Resources

Promote reliability engineering principles and serve as a technical resource on reliability engineering for ASQ, standards agencies, industry, government, academia and related disciplines

Training

Sponsor, present and promote reliability, maintainability, and related training materials for courses, symposia, and conferences.

108